alpha om338t45无铅锡膏 ultra fine feature lead-free solder paste description alpha om-338-t45 is a lead-free, no-clean solder paste designed for a broad range of applications. alpha om-338-t45’s broadprocessing window is designed to minimize transition concerns from tin/lead to lead free solder paste. this material is engineered to deliver the comparable performance to a tin lead process.* alphaom-338-t45 yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability and high “through-put” applications. outstanding reflowprocess window delivers good soldering on cuosp with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. alphaom-338-t45 is formulated to deliver excellent visual joint cosmetics. additionally, alpha om-338-t45’s capability of ipc class iii for voiding and rol0 ipc classifications ensures maximum long-termproduct reliability. *although the appearance of these lead-free alloys will be different to that of tin-lead, with mechanical reliability equal to or greater than with that of tin-lead ortin-lead-silver. features & benefits maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.25mm (0.010”) with 0.100mm (4mil)stencil thickness. excellent print consistency with high process capability index across all board designs. print speeds of up to 200mm/sec (8”/sec), enabling a fast print cycle time and a highthroughput. wide reflow profile window with good solderability on various board / component finishes. excellent solder and flux cosmetics after reflow soldering reduction in random solderballinglevels, minimizing rework and increasing first time yield meets highest ipc 7095 voiding performance classification of class iii. excellent reliability properties, halide-free material compatiblewith either nitrogen or air reflow product information alloys: sac405 (95.5%sn/4.0%ag/0.5%cu) powder size: type 4.5 residues: approximately 5% by (w/w) packaging sizes: 500 gram jars, lead free:complies with rohs directive 2002/95/ec. application formulated for both standard and fine pitch stencil printing, at print speeds of between 25mm/sec (1”/sec) and 200mm/sec (8”/sec), with stencilthickness of 0.100mm (0.004”) to 0.150mm (0.006”), particularly when used in conjunction with alpha? stencils. blade pressures should be 0.16-0.34 kg/cm of blade (0.9 -2ibs/inch), depending upon theprint speed. the higher the print speed employed, the higher the blade pressure that is required. the reflow process window will give high soldering yield with good cosmetics and minimized rework.
深圳市汉泰电子辅料有限公司
13421305358
广东深圳市宝安区西乡西堤