加工定制是	品牌子庚
型号SD-1170	最高电压12V
额定发热电流1A	用途电子产品
产品认证ROHS	物料编号1170
属性电阻荷小	特点回弹力度稳定

 item
项 目
   
soldering conditions
焊接条件
(1)preheat temperature
预热温度
   
100℃ max
(ambient temperature of printed circuit board on its soldering side)(电路板周围焊锡面的温度)
(2)preheat time
预热时间
   
45 sec max
45秒 max
(3)flux foaming
助焊剂浸泡
   
to such an extent that flux will be kept flush with the printed circuit boards,top surface on which components are
mounted.prdparatory flux must not be applied to that sode of printed circuit board on which components are mounted
and to the area whiere terminals are located.
助焊剂应涂在电路板上组装开关的印刷面上半部位，应防止助焊剂过量到电路板.
(4)solderin
temperature
焊锡温度
   
255℃  max
255℃  max
(5)duration of solder immersion
焊接时间
   
5 sec  max
5秒 max
(6)allowable
prequency
允许重焊次数
   
2 times max
2 次  max
       2.other precautions 其他注意事项
         (1) following the soldering process,do not try to clean the switch solvent or the like
             进行焊接工艺时不应使用不整洁的东西对开关进行清洁。
         (2) safeguard the switch assembly against flux penetra tion from its top side
             在组装开关时应防止助焊剂从开关的上部流入到开关内部