mh includes the following on a single silicon chip: voltage regulator, hall voltage generator, small-signal amplifier, chopper stabilization, schmitt trigger, open-drain output. advanced cmos wafer fabrication processing is used to take advantage of low-voltage requirements, component matching, very low input-offset errors, and small component geometries.
is rated for operation between the ambient temperatures –40℃ and +85℃ for the e temperature range. the four package styles available provide magnetically optimized solutions for most applications. package types so is an sot-23(1.1 mm nominal height), sq is an qfn2020-3(0.55 mm nominal height), a miniature low-profile surface-mount package, while package ua is a three-lead ultra mini sip for through-hole mounting.
the package type is in a halogen free version was verified by third party lab.
江西攀驰电子科技有限公司
15206458696
中国 九江
