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陶瓷薄膜电路 金锡热沉 金锡合金

2019/4/7 2:28:30发布134次查看
  • 加工定制:
  • 特性:高频高介陶瓷
  • 功能:客户定制
  • 提供加工定制:是
  • 微观结构:单晶
  • 规格尺寸:客户定制
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laser diode submounts (au/sn)applied thin-film products (atp) is one ofthe industry leaders for laser diode submounts with pre-depositedau/sn. atp custom fabricates thin-film submounts with tightlycontrolled substrate and metal thicknesses for your alignmentneeds. hi-thermal conductivity materials include aluminum nitride(aln) and beryllium oxide (beo).
these submounts can have pre-deposited andpatterened gold tin (au/sn) to accommodate lower manufacturingcost, higher volume, and automated assembly of laser diode modules.the use of pre-deposited and patterned au/sn replaces the moretraditional approach of using thick au/sn preforms. atp’s standardalloy composition is 80% au and 20% sn which reflows at 284°c under10% forming gas.
other au/sn custom compositions areavailable. atp offers a sputtered and plated au/sn eutectic.samples are available. please ask for atp1014s for sputtered andatp1014p for plated.
•replacestraditional au/sn preforms
•accurately controlled thickness
•lot tolot consistency
•reduceau/sn thickness
•homogeneous 90% au/10% sn
•homogeneous 80% au/20% sn
•homogeneous 70% au/30% sn
•complexsolder pad geometries
•accuratelaser alignment
substrate materialaluminum nitride (aln)
•170 w/mk thermal conductivity
•200 w/mk thermal conductivity
•<2µ (50nm) surface finish
beryllium oxide (beo)
•270 w/mk thermal conductivity
•2µ–4µ (50nm–100nm) surface finish
alumina oxide (al203)
•26.9 w/mk thermal conductivity
•<1µ to 3µ (<25nm–75nm) surfacefinish
pre-deposited and patterned au/snguidelines•smallestfeature size: 0.002 x 0.002 (0.078mm x 0.078 mm)
•minimumpitch (minimum space between au/sn pads): 0.002 (0.078mm)
•maximumau/sn thickness: 400µ (10 microns)
•typicalau/sn thickness: 160–200µ (4–6 microns)
•minimumau/sn thickness: 80µ (2 microns)
•toleranceon thickness of au/sn: ±80µ (±2 microns)
•placementaccuracy of au/sn: ±0.0005 (±0.0127mm)
•dimensional tolerance on au/sn pad: ±0.0002(±0.005mm)
•minimumpull back from laser cut edge: 0.0015 (0.0381mm)
•minimumpull back from conductive plated thru via holes: 0.0025(0.0635mm)

上海傲来薄膜电路有限公司
万光琴
18930063746
上海市普陀区古浪路415弄4号楼2楼南
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