1. summary
(a) rohs compliant & halogen free
(b) applications: all high-density boards
(c) product features: small surface mountable, solid state, fastertime to trip than
standard smd devices, lower resistance than standard smddevices
(d) operation current: 0.75a
(e) maximum voltage: 6v
(f) temperature range : -40℃ to 85℃
2. agency recognition
ul: file no. e211981
c-ul: file no. e211981
tüv: file no. r50090556
7.material specification
terminal pad material: pure tin
soldering characteristics: meets eia specification rs 186-9e,ansi/j-std-002 category 3
8. part numbering and marking system
part numbering system part marking system
note 1: all temperatures refer to of the package,
measured on the package body surface
solder reflow
※
due to “lead free” nature, temperature and
dwelling time for the soldering zone is higher
than those for regular. this may cause
damage to other components.
1. recommended max past thickness > 0.25mm.
2. devices can be cleaned using standard
methods and aqueous solvent.
3. rework use standard industry practices.
4. storage envorinment : < 30
℃
/ 60%rh
caution:
1. if reflow temperatures exceed the
recommended profile, devices may not meet
the performance requirements.
2. devices are not designed to be wave soldered
to the bottom side of the board.
warning: -operation beyond the specified maximum ratings orimproper use may result in damage and possible
electrical arcing and/or flame.
-pptc device are intended for occasional overcurrent protection.application for repeated overcurrent
condition and/or prolonged trip are not anticipated.
甲、
-avoid contact of pptc device with chemical solvent. prolongedcontact will damage the device
performance

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深圳市博隆达科技有限公司
王小姐
18948757819
深圳市南山区桃源街道龙井村南汾大厦1栋601