preheat: temperature on the copper foil surface
should reach 180℃, 2±0.3 minutes after
the p.w.b entered into the soldering equipment
预热:在p.w.b(印刷线路板)进入焊接设备后,
2±0.3分钟内铜箔表面要达到180℃
soldering heat: temperature on the copper
foil surface should reach the peak temperature of
260℃ within 5 seconds after the
p.b.w entered into soldering heat zone.
焊接温度: 在p.w.b(印刷线路板)进入焊接温区5秒内,
铜箔表面达到峰值温度260℃