clamshell “injection molded”type  icdevelopment sockets - over view
very easy open/close method,no screws, no toolsrequired
smt, thru hole orcompression mount
bandwidths up to 3ghz(smt)
bandwidths over 10ghz(compression mount)
integrated aluminumheatsink available
lid opening allows forfailure analysis/probing
lid opening allows foroptical ic development
low profile and mountsin ic's footprint (smt mount)
pitches down to 0.5mm(smt and thru hole mounts) or 0.4mm (compression mount)
any grid
clamshell type bga socket data sheet
mechanicaldata
contact life:
10,000 cycles min.
solderability :
as per iec 60068-2-58
individual contact force:
40 grams max.
material
insulator (rohs compliant):
high temp plastic or epoxy fr4
terminal (rohs compliant):
brass
contact (rohs compliant):
becu
electricaldata
contact resistance:
< 100 mω
current rating:
500 ma max.
insulation resistance:
at 500v dc  100 mω if 0.50 to 0.80mmpitch
                 500 mω 1.00mm pitch upwards
breakdown voltage:
 at 60 hz   500v min.
capacitance:
< 1 pf
inductance:
< 2 nh
operating temperature:
-55°c to +125°c ; 260°c for 60 sec.
these sockets areavailable for almost any ic package style, size, lead-count andlead-pitch down to 0.5mm pitch: bga, mlf/qfn, ubga, soic, qfp andalso custom packages or die. furthermore, these sockets provideflexibility in the pcb mounting method: smt, raised smt,through-hole, or compression mount.smt (pin type -30) usesa standard reflow process to mount the sockets to the target pcb.these sockets mount in the same footprint as the ic, but typicallyrequire a mimimum clearance of 6mm betyond the package's periphery.in situations where adjacent components lie in this area, eitherthe socket body can be modified to clear the components, or aspecial raised smt (pin types -28 or -29) pin can be used inplace of the standard smt pin. these pins raise the socket bodyfrom 2-5mm above the pcb. although this method does not require anydrilled holes in the target pcb, it is highly recommended toprovide two such plated holes in order to accomodate mounting pegsand greatly strengthen the physical connection between the socketand pcb. alternatively, epoxy can be used to strengthen theconnection, but this more or less creates a permanent bond betweenthe socket and pcb.through-hole (pin type-70) requires plated holes to be drilled in the pcb into which thepins of the socket will be soldered. this provides for a veryrobust and reliable electrical and mechancial connection. however,the electrical performance is reduced due to the longer pinlengths. this method is highly suitable for burn-inapplications.compression (pin type-90) mount removes the need for any soldering and just requires thesocket to be held to the pcb via screws. the benefit of this methodis that it allows the customer to easily attach the socket to thetarget board in the lab, without the extra cost, lead-time, andpotential problems caused by sending the board to an assemblyhouse. however, this method requires that the target pcb hasmounting holes drilled to accomodate the mounting screws and socketbody alignment posts. furthermore, depending on the size of the ic,the pcb thickness, etc., a backing plate is required to providerigidity and ensure the socket pins contact the pcb pads. thisplate can usually be modified to accomodate any backsidecompononents.
smt (-28, -29,-30) through-hole (-70) compression (-90)
socket bodyvertical offsetthe following table shows thevertical clearance of the socket body from the pcb. this is onlyapplicable to the smt mounting style. in situations where theclearance is insufficient, or the standard smt pin is preferred, itis possible to modify the socket body to accomodate for adjacentcomponents.
　pitchvertical offset using specialraised smt
(-28) vertical offset using raisedsmt
(-29) vertical offset using standardsmt
(-30)
0.50-0.75 n/a 2.3 0.4
0.8 4.5 2.8 0.6
1.00 4.5 3.2 0.8
1.27 n/a 5.0 1.2
dimensions in mmfeatures &benefitseasily exchange ics in yoursystemhigh bandwidth: 3ghz @-1dbavailable for any ic packagestyle: bga, ubga, csp, qfn/mlf, lga, pga, soic, qfp, custom ordieany lead count, grid andpackage sizeminimum 0.5mm leadpitchmaximum 40g force percontactmounts to same pcb footprintas the ic (no holes required for smt version)low profile: <10mm highwith icminimal keepout area: approx.6mm beyond ics peripheryraised smt version availablefor lifting socket over adjacent componentsheat dissipation via lidcut-out or integrated heatsinkthermal expansion, shock &vibration absorbed by contact designlga contact design can also beused for board-to-board connectionsstandard-process design &manufacturing = lower cost and tailored to your needs

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