alpha® cvp-520 is designed to enable low temperature surface mount assembly technology. the lead-free alloy in alpha® cvp-520 has a melting point below 140°c, and has been successfully used with peakreflow profiles between 155°c and 190°c. the flux residue from alpha® cvp-520 is clear, colorless, and provides excellent electrical resistivity, exceeding industry standards. this product enablesthe elimination of an extra wave or selective wave soldering process when temperature sensitive through hole components are used in an assembly. eliminating a wave soldering or selective solderingstep can significantly lower the cost of producing an electronic assembly, increase daily throughput, eliminate the need for managing bar solder and wave soldering flux supplies and eliminate theneed for pallets. the carefully selected sn/bi/ag alloy in alpha® cvp-520 was selected to give the lowest melting point, lowest pasty range during melting and re-solidification, along with a veryfine grain structure, offering maximum resistance to thermal cycle based fatigue. the alloy also yields very low voiding bga solder joints, even when a traditional sac alloy sphere is used. the useof alpha® exactalloy™ performs may enable the elimination of selective wave soldering by providing additional solder volume when needed. all components used with alpha® cvp-520 must be lead-free toeliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100ºc.

---

深圳市汉泰电子辅料有限公司

13421305358
广东深圳市宝安区西乡西堤