苏州佳士华贸易有限公司长期供日本千住锡膏(m705-grn360-k2-v / m705-grn360-k2 / m705-grn360-l60c / m705-plg-32-11) ； 千住无卤锡膏(m705-shf / s70g-hf) ;美国阿尔法锡膏( om310/om338 /om325/om338pt/om338pt/om338t45/om340/om340uv/om350/ws619/ws819/ws820/cvp520 /om5000/om5002/om5100/ol-107e / up78)；美国阿尔法助焊剂(rf800\rf800t\rf800t3\rf800ns\ef2210\ef3215\ef6100\ef6100p\ef6100r\ef6000\ef8000\ef8000gl\ef9301\ef10000\ef12000\nr330\nr205\nr310b\nr310h\ws856\ws857\ws859\ws9132\260f\260hf\265hf\310s\320a\3355-11\3355hb\3355vf\550ht\615\ls500a\sls23f\sls10w\sls25f\sls56f\sls27f\sls60\sls65\sls65c\sls65h) ；阿尔法清洗剂（2110\926\2002d\2007\2444\autoclean40\bc-2200\bc-2400\bc-3300\sc7525\sc-30\sm110\sm110e\sm440\2001p\2003\e-2001\e-2001a\e-2001ws\e2001sc\ec-15\ec-7r\sc-10\sc-10e\）；阿尔法助焊膏（up78\lr725\om338\om340\7lv\9lv）;阿尔法稀释剂（rf800add\373add\425\3355-11add\）tamura锡膏(tlf-204-111/tlf-204-93/tlf-204-19a/tlf-204-85/tlf-204-49/tlf-204-mds/rma-010-fp)； tamura无卤锡膏（tlf-204-nh）；日本koki锡膏（s3x48-m406-3系列/ s3x58 -m406-3/s3x58-m650-3/s3x48-m650-3/s3x58-650/s3x58-650-3/s3x58-kv40/s3x58-m405 /s3x58-m405-2系列/s3x58-m406d/s3x58-m406系列/se4-m953/se48-m600-3c/se48-m955/se48-1000-3/se48-m9555lv/se58-m405l-2/se48-m954-2)；日本阿米特almit锡膏 （lfm-48w tm-hp / lfm-48w tm-ts / lfm-48w tm/lfm-48wnh(d)/ssna-sj.s;kester锡膏（909hps/em918ap/ em923ap）；减摩锡膏（np303-cqs-1/np303-cqs-2/np303-gm755/np303-gm855-gk/np303-ld155-gq/np303-mf155-gq/np303-cqs-1h）；日本富士红胶(fuji sealglue)(ne8800k / ne8800t / ne3000s / 200gr、40gr、30gr、20gr)； 德国乐泰红胶(3611 / 3609) ；德国贺利氏黄胶（pd955py /pd945m）;德邦胶水；优耐特胶水；贝迪标签；艾利不干胶标签；国产助焊剂和清洗剂。 如有需要了解产品或取得相关资料请垂询
乐泰无铅免洗锡膏lf328
low-voiding lead-free solder paste
product description
multicore lf328 solder paste is a halide-free, no clean,pb-free solder paste, which has a broadprocesswindow,forprinting,reflowand humidity resistance. lf328 solder pastehas been formulated to give low voiding inbgajoints,ahightack force to resist component movement during high speed placement, long printer abandon times and excellent solderabilityovera wide range of reflow profiles in air andnitrogen and across a wide range of surface finishes including ni/au, immersion sn, immersion ag and osp copper.
features and benefits
•excellent print process capability for 0.5mm and 0.4mmpitch csp
•long abandon time capability (>75minutes on 0.4mmcsp)
•allows fast print speed with low print pressure
•humidity resistance – excellent coalescence after 8 hours exposure to 27ºc/80% rh.
•colorless residues for easy post-reflow inspection
•ultra-low voiding
•halide free flux classification: rol0 to ansi/j-std-004
苏州佳士华贸易有限公司
李林雄
18936092951
苏州新区馨泰花苑商业房6幢1A室